n-channel p-channel CMOS竞选,以先进的工艺制造晶体管。
如LDD和销售为模块。面膜组是什么基本上是相同的。
第6 CMOS150过程(S / D除外),接触的面具。
它使打印0.4微米装置,S / D面具改性聚植入整个地区。
________________________________________________________________________。
0.0起始片(10):36-63 ohm-cm >,< 100,电学,6 "。
________________________________________________________________________。
目标1:初始氧化= 25(+ / - 5%)海里。
包括2人形靶为点腐蚀特性。
________________________________________________________________________。
11 TLC干净的炉管(tystar2)。
_______________________________________________________________________。
在sink9 1.2标准干净的晶片(马铁)。
10/1高频浸到dewet,spin-dry。
________________________________________________________________________。
13干氧化在950 C(2DRYOX)。
30术:目标可以隐形干燥的氧气。
20术:目标可以隐形干氮气。
氧化层厚度测量)=
________________________________________________________________________。
2.0零层的照片
标准DUV光刻工艺。
HMDS(程序),svgcoat6 1 svgcoat6外套(程序),2个。
每分钟转速= 1480,UV210-0.6)、软烘烤(130 C接近),。
ASML暴露(0标志着面膜,约30兆/平方厘米),。
这件事(程序,对svgdev6 130 C),。
1在svgdev6发展(程序)。
UVBAKE硬烤:[J].(程序)。
________________________________________________________________________。
翻译成零层的2.1基质。
一)在lam2 SIO2MON氧化腐蚀配方。
检查、调整时间实际蚀刻速率。
lam4蚀刻矽中)
(= 1200年,目标深度、腐蚀配方= 6000股)的时间30秒。
注:其它选择lam4 6200配方,含25秒,SF6 = = 30秒。
(配方200和6000合并)。
书记和c)在每片晶片数目,包括控制。
灰胶在矩阵。
d)测量深度用asiq结盟。
________________________________________________________________________。
氧化氮3.0垫层沉积。
目标= 25海里二氧化矽氮+ 180海里)。
________________________________________________________________________。
干净的炉管(310薄tystar2)。tystar9保护区。
________________________________________________________________________。
在sink9 3.2标准干净的薄饼。
(MEMS、马鞍山、掏高频25:1直到dewet)。
包括NCH、PCH控制晶片。
________________________________________________________________________。
在1000 C 3.3干燥的氧化(2DRYOX)。
21术:目标可以隐形干燥的氧气。
15分钟干氮气退火。
氧化层厚度测量和NCH PCH上。
________________________________________________________________________。
34存款180海里的氮化硅(9SNITA)。
approx.时间、术:目标可以隐形55 = = 800℃。
氮化层厚度测量。(nanospec)。
到底什么是"摩尔定律'"?归纳起来,主要有以下三种"版本":
1、集成电路芯片上所集成的电路的数目,每隔18个月就翻一番。
2、微处理器的性能每隔18个月提高一倍,而价格下降一倍。
3、用一个美元所能买到的电脑性能,每隔18个月翻两番。
以上几种说法中,以第一种说法最为普遍,第二、三两种说法涉及到价格因素,其实质是一样的。三种说法虽然各有千秋,但在一点上是共同的,即"翻番"的周期都是18个月,至于"翻一番"(或两番)的是"集成电路芯片上所集成的电路的数目",是整个"计算机的性能",还是"一个美元所能买到的性能"就见仁见智了。
"摩尔定律"的由来:
"摩尔定律"的"始作涌者"是戈顿·摩尔,大名鼎鼎的芯片制造厂商Intel公司的创始人之一。20世纪50年代末至用年代初半导体制造工业的高速发展,导致了"摩尔定律"的出台。
早在1959年,美国著名半导体厂商仙童公司首先推出了平面型晶体管,紧接着于1961年又推出了平面型集成电路。这种平面型制造工艺是在研磨得很平的硅片上,采用一种所谓"光刻"技术来形成半导体电路的元器件,如二极管、三极管、电阻和电容等。只要"光刻"的精度不断提高,元器件的密度也会相应提高,从而具有极大的发展潜力。因此平面工艺被认为是"整个半导体工业 键",也是摩尔定律问世的技术基础。
1965年4月19日,时任仙童半导体公司研究开发实验室主任的摩尔应邀为《电子学》杂志35周年专刊写了一篇观察评论报告,题目是:"让集成电路填满更多的元件"。摩尔应这家杂志的要求对未来十年间半导体元件工业的发展趋势作出预言。据他推算,到1975年,在面积仅为四分之一平方英寸的单块硅芯片上,将有可能密集65000个元件。他是根据器件的复杂性(电路密度提高而价格降低)和时间之间的线性关系作出这一推断的,他的原话是这样说的:"最低元件价格下的理杂性每年大约增加一倍。可以确信,短期内这一增长率会继续保持。即便不是有所加快的话。而在更长时期内的增长率应是略有波动,尽管役有充分的理由来证明,这一增长率至少在未来十年内几乎维持为一个常数。"这就是后来被人称为"摩尔定律"的最初原型。
"摩尔定律"的修正
1975年;摩尔在国际电信联盟IEEE的学术年会上提交了一篇论文,根据当时的实际情况,对"密度每年回一番"的增长率进行了重新审定和修正。按照摩尔本人1997年9月接受(科学的美国人)一名编辑采访时的说法,他当年是把"每年翻一番"改为"每两年国一番",并声明他从来没有说过"每18个月翻一番"。
然而,据网上有的媒体透露,就在摩尔本人的论文发表后不久,有人将其预言修改成"半导体集成电路的密度或容量每18个月翻一番,或每三年增长4倍",有人甚至列出了如下的数学公式:(每芯片的电路增长倍数)=2(年份-1975)/1.5。这一说法后来成为许多人的"共识",流传至今。摩尔本人的声音,无论是最初的"每一年图一番"还是后来修正的"每两年翻一番"反而被淹没了,如今已鲜有人知。
历史竟和人们开了个不大不小的玩笑:原来目前广为流传的"摩尔定律"并非摩尔本人的说法!
"摩尔定律"的验证
摩尔定律到底准不准?让我们先来看几个具体的数据。1975年,在一种新出现的电荷前荷器件存储器芯片中,的的确确含有将近65000个元件,与十年前摩尔的预言的确惊人地一致!另据Intel公司公布的统计结果,单个芯片上的晶体管数目,从1971年4004处理器上的2300个,增长到1997年Pentium II处理器上的7.5百万个,26年内增加了3200倍。我们不妨对此进行一个简单的验证:如果按摩尔本人"每两年翻一番"的预测,26年中应包括13个翻番周期,每经过一个周期,芯片上集成的元件数应提高2n倍(0≤n≤12),因此到第13个周期即26年后元件数应提高了212=4096倍,作为一种发展趋势的预测,这与实际的增长倍数3200倍可以算是相当接近了。如果以其他人所说的18个月为翻番周期,则二者相去甚远。可见从长远来看,还是摩尔本人的说法更加接近实际。
也有人从个人计算机(即PC)的三大要素--微处理器芯片、半导体存储器和系统软件来考察摩尔定律的正确性。微处理器方面,从1979年的8086和8088,到1982年的80286,1985年的80386,1989年的80486,1993年的Pentium,1996年的PentiumPro,1997年的PentiumII,功能越来越强,价格越来越低,每一次更新换代都是摩尔定律的直接结果。与此同时PC机的内存储器容量由最早的480k扩大到8M,16M,与摩尔定律更为吻合。系统软件方面,早期的计算机由于存储容量的限制,系统软件的规模和功能受到很大限制,随着内存容量按照摩尔定律的速度呈指数增长,系统软件不再局限于狭小的空间,其所包含的程序代码的行数也剧增:Basic的源代码在1975年只有4,000行,20年后发展到大约50万行。微软的文字处理软件Word,1982年的第一版含有27,000行代码,20年后增加到大约200万行。有人将其发展速度绘制一条曲线后发现,软件的规模和复杂性的增长速度甚至超 过了摩尔定律。系统软件的发展反过来又提高了对处理器和存储芯片的需求,从而刺激了集成电路的更快发展。
这里需要特别指出的是,摩尔定律并非数学、物理定律,而是对发展趋势的一种分析预测,因此,无论是它的文字表述还是定量计算,都应当容许一定的宽裕度。从这个意义上看,摩尔的预言实在是相当准确而又难能可贵的了,所以才会得到业界人士的公认,并产生巨大的反响。
"摩尔定律"的变种
摩尔定律的响亮名声,令许多人竞相仿效它的表达方式,从而派生、繁衍出多种版本的"摩尔定律",其中如:
摩尔第二定律:摩尔定律提出30年来,集成电路芯片的性能的确得到了大幅度的提高;但另一方面,Intel高层人士开始注意到芯片生产厂的成本也在相应提高。1995年,Intel董事会主席罗伯特·诺伊斯预见到摩尔定律将受到经济因素的制约。同年,摩尔在《经济学家》杂志上撰文写道:"现在令我感到最为担心的是成本的增加,…这是另一条指数曲线"。他的这一说法被人称为摩尔第二定律。
新摩尔定律:近年来,国内IT专业媒体上又出现了"新摩尔定律" 的提法,则指的是我国Internet联网主机数和上网用户人数的递增速度,大约每半年就翻一番!而且专家们预言,这一趋势在未来若干年内仍将保持下去。
"摩尔定律"的终结
摩尔定律问世至今已近40年了。人们不无惊奇地看到半导体芯片制造工艺水平以一种令人目眩的速度提高。目前,Intel的微处理器芯片Pentium 4的主频已高达2G(即1 2000M),2011年则要推出含有10亿个晶体管、每秒可执行1千亿条指令的芯片。人们不禁要问:这种令人难以置信的发展速度会无止境地持续下去吗?
不需要复杂的逻辑推理就可以知道:芯片上元件的几何尺寸总不可能无限制地缩小下去,这就意味着,总有一天,芯片单位面积上可集成的元件数量会达到极限。问题只是这一极限是多少,以及何时达到这一极限。业界已有专家预计,芯片性能的增长速度将在今后几年趋缓。一般认为,摩尔定律能再适用10年左右。其制约的因素一是技术,二是经济。
从技术的角度看,随着硅片上线路密度的增加,其复杂性和差错率也将呈指数增长,同时也使全面而彻底的芯片测试几乎成为不可能。一旦芯片上线条的宽度达到纳米(10-9米)数量级时,相当于只有几个分子的大小,这种情况下材料的物理、化学性能将发生质的变化,致使采用现行工艺的半导体器件不能正常工作,摩尔定律也就要走到它的尽头了。
从经济的角度看,正如上述摩尔第二定律所述,目前是20-30亿美元建一座芯片厂,线条尺寸缩小到0.1微米时将猛增至100亿美元,比一座核电站投资还大。由于花不起这笔钱,迫使越来越多的公司退出了芯片行业。看来摩尔定律要再维持十年的寿命,也决非易事。
然而,也有人从不同的角度来看问题。美国一家名叫CyberCash公司的总裁兼CEO丹·林启说,"摩尔定律是关于人类创造力的定律,而不是物理学定律"。持类似观点的人也认为,摩尔定律实际上是关于人类信念的定律,当人们相信某件事情一定能做到时,就会努力去实现它。摩尔当初提出他的观察报告时,他实际上是给了人们一种信念,使大家相信他预言的发展趋势一定会持续。
第1份:
LED项目商业计划书
Chapter One Summary of this Business Plan。
1. Company Introduction。
Founded in November 2003 with a registered capital of 50, 000, 000 USD$, Dalian Lumei Optoelectronics Co., Ltd. is a new high-tech enterprise mainly engaged in the R&D, production and sales of high-brightness light emitting diodes (LED) chips. It is located inside Dalian Photoelectron Program Industry Base at No.1 Huanghai Avenue in the Economic and Technological Development Zone of Dalian City, covers an area of 200, 000 square meters, and its total construction area reaches as much as 63, 515 square meters. Having been established for more than one year, the Company has already conducted key scientific and technological project in the “Tenth Five Year Plan” of Ministry of Science and Technology of China, the bidding project of development funds by the Ministry of Information Industry as well as projects of the local government. It is also one of the standing director organizations of the Chinese semiconductor lighting R&D and industry alliances, and has participated in the development of technical standards and industrial regulations in the Chinese semiconductor lighting industry.。
2. Products and Technologies。
The industrial chain of the LED industry is divided into four industrial stages of the upper-end epitaxial wafers manufacturing, middle-end chip preparation and lower-end chip package as well as production of application products. LED products are first made of epitaxial wafers produced with the tube core processing technique that is similar to the manufacturing of integrated circuit, and are then divided up into several crystal grains, each of which can be processes into one LED chip. Finally, LED chip becomes light emitting diode through package. The key industrial process undertaken by Dalian Lumei Optoelectronics Co., Ltd. includes developing GaN epitaxial wafers into several tiny LED chips (that is chip of the light emitting diode) through several key techniques including lithography, plating and cutting.。
As a revolutionary kind of new light source, LED has quite obvious advantages in replacing current traditional lighting. Traditional head lamps transforms electrical energy into heat energy, which is then further transformed into light energy through medium of noxious substances like mercury or inert gases, and energy is thereby severely lost after two transfers and transformations. LED, on the other hand, directly transforms electrical energy into light energy and avoids great energy waste and creation of harmful gases in the transformation process of electrical and heat energies. It has quite remarkable energy conservation and environmental protection benefits and is of epoch-making significance. By adopting LED as the new lamp-house, consumption of electricity under the same brightness will only be 10% of that with ordinary filament lamp, while life span can be extended up to 100 times. It is estimated that the national consumption of electricity in China will reach 2,700 bn. kwh in 2010 and the lighting consumption will exceed 300 bn. kwh. Under the condition of same brightness, if 1/3 of filament lamps are replaced by semiconductor lamps, nearly 100 bn. kwh of electricity can be saved for the country each year, which is equivalent to the electric power generation of the Three Gorges Project. At the present time, LED technology has been extensively used in areas like automotive and traffic signal lamps, LCD backlights, large screen display, decoration, landscape lighting, special lighting, public lighting as well as tourism and light industry products.。
Main products of the Company include high-brightness blue, cyan and green chip products. The Company will develop towards production on the upper-end of the industrial chain -- epitaxial wafers in the future, and become a large LED manufacturing enterprise that integrates epitaxial production with chip production. Chip products of the Company are characterized by fairly good reliability, long-term stability and consistency, high brightness anti-static levels, which are shown as long acceptable life and low color and brightness decay rates, etc. Thanks to the super fine quality performances of the products, they have been mainly used in areas like full-color large screen display and traffic signal lamps, which present the highest requirements for LED product quality performances.。
The Company has continued to use production technologies of the former American AXT Inc. and taken up a relatively leading position in the world. At present, it has mastered the unique and advanced epitaxial growth technique and chip processing technique, possessed complete intellectual property rights in epitaxials and chips by holding 31 patents. Dalian Lumei Inc. has technical teams made up of overseas geniuses from AXT Inc., and specially hired domestic doctors, masters and bachelors graduated from distinguished universities like Tsinghua University, as well as experienced technical experts cultivated by Luming Group for several years, all of which make up a strongly professional R&D team with multi-national backgrounds. Meanwhile, the Company has also attached great importance to the input of technological R&D to accomplish research and development of new products within a shore period of time so as to keep the technological leading position of the products. In addition, it has close business contacts and cooperation relations with units like Dalian University of Technology, Xiamen University, Jilin University, Zhejiang University as well as Chinese Academy of Sciences. Through the above-mentioned cooperation, the Company undertakes to solve key technical problems in the manufacturing techniques of high-power LED.。
3. Market Conditions。
In recent years, the market size of LED products has been continuously on the increase. The global LED market has increased to US$ 4.7 billion in 2004 from the US$3 billion in2001, increased by more than 20% annually. Among that, the increase of high-brightness LED has been more rapid, and its market size has risen to US$3.7 billion in 2004 from the US$1.2 billion in 2001. Its annual growth rate within the decade from 1995 – 2004 has reached as much as 46%. As predicted by Strategies Unlimited, the market of high-brightness LED will continue to rise at a rate of 17% in the coming few years, and will reach US$ 5.9 billion in 2008, with the advent of LED white lighting era.。
As a new generation of green lighting industry, semiconductor lighting industry plays a significant role in the development of national economy and the environmental protection. In recent years, developed countries in the world have introduced national semiconductor lighting program one after another and invested huge amount of capital into the R&D. At present, world leading companies in lighting like Philips, Osram and GE have all regarded LED as a key industry to be developed. Philips even spent 95 million USD$ to acquire the 47% shares in Lumileds originally held by Agilent in August, 2005, thus enabled its total shareholding to arrive at 96.5%, which represented its great expectation in the application of GaN LED into the lighting business. According to the predictions of iSuppli, the annual compound growth rate of LED in the ordinary lights market will be as high as 52% in the coming five years. Out of considerations of market and cost, the global manufacturing industry has been gradually shifting to Asia and China in particular. China has now become the largest manufacturing base for lighting lamps and lanterns in the world, whereas developing the semiconductor lighting industry has also become common sense of the Chinese government and the industry. In addition, the Chinese government has already started to actively promote a resource efficient society in confronting with the increasingly severe energy crisis. As an effective method to solve energy crisis, the semiconductor lighting industry will be supported and developed with priority by the government.。
4. Corporate Competitive Advantages。
Product advantages: Performance indexes of the product, such as long-term stability, reliability, brightness and anti-static capability have all reached international leading or advanced level. Compared with US and Japanese companies, products of this company also enjoy price advantage, while it has quite clear technological advantages in comparison with domestic and Taiwan companies;。
Core technology and intellectual property right advantages: The Company possesses 31 patents and all the LED technological and intellectual property rights owned by the former AXT Inc., has mastered the unique and advanced epitaxial growth techniques and chip processing techniques, as well as has been equipped with complete epitaxial and chip intellectual property rights;。
Technical team advantages: The Company has a pool of talents with high quality and a quite strong technical team. Researchers include technicians who have obtained doctors’ degree in the US and had professional working experiences in large American corporations, as well as specially hired experienced domestic experts, all of which make up a highly professional R&D team;。
Market advantages: The unique resource structure of the Company has brought it with out-border market advantages, and the customer network of the former AXT Inc. plays a significant role in the Company; thanks to their performance advantages, the products can quickly take up the high-end domestic market such as large screen display and signal lamps. The demand of the products outstrips their supply, with quite obvious market advantages.。
Cooperation advantages: Cooperation of the Company with Dalian Luming Science and Technology Group and the American LUMEI OPTOELECTRONICS CORP. will create fairly remarkable cooperation advantages. Combination of chip advantage at Lumei and fluorescent powder advantage at Luming will bring out well coordination effect;。
Policy and geographical location advantages: Located at the center of the Bohai-Rim Economic Circle, Dalian city is window to the economic development in North East China and front of revitalizing the old industrial bases in the North East. At the prime location of the Bohai-Rim Economic Circle and North East Asian Economic Circle, the city borders on hinterland of North East China and Inner Mongolia, and is next to developed countries and regions in the photoelectron industry like Japan and South Korea in the south. Coupled with advanced air, water and land transportation, it is the ideal place for developed countries to shift and diffuse their technological projects to China. The city has always taken the lead with regard to taxation, land, talent introduction as well as investing and financing mechanisms in North East China. The Dalian Municipal Government has attached great importance to the development of the semiconductor lighting industry, and has specially set up a photoelectron industrial area of 10 square kilometers in its economic and technological development zone to be used in the development of semiconductor lighting industry, and the area has been listed as a national “Semiconductor Lighting Industrial Base”.。
5. Corporate Operation Plan。
The Company plans to expand its corporate production scale based on the existing conditions and to increase its annual production capacity to 3 billion pieces of standard chips from the current 600 million pieces per year. It has already invested in US$50 million to have a workshop capable of 3 billion pieces, power equipments, intellectual property rights as well as production equipments of 600 million pieces. In order to realize the production capacity of 3 billion pieces, the Company will need to inject a further fund of 250 million RMB. After realizing the production of the expansion, annual sales revenue of the Company is expected to amount at 930 million RMB and the total annual profit will reach more than 90 million RMB.。
6. Management Team and Human Resources。
Management team of the Company is a high quality team with reasonable staff structure and experienced and dedicated staffs. It is made up of professionals with scientific research, market and management experiences in various fields. The chairman and president, Mr. Xiao Zhiguo, has years of technological R&D experiences and corporate management experiences. He founded Dalian Luming Group in 1992, and now the group has developed into a large corporate. President Xiao owns dozens of invention patents in total, and has been continuously awarded the title of “Invention Genius in Dalian City”, “Excellent Talent in Dalian City”, “Top-grade Model Worker”, “Excellent Science and Technological Worker in Liaoning Province” as well as “Excellent Private-run Science and Technological Entrepreneurs in China”.。
7. Financing Plan and Financial Analysis。
The Company at present seeks a fund of RMB250 million in an attempt to realize the objective of expanding production capacity and improve market share. The financing methods is equity financing.。
In accordance with the investment plan and financial forecast of the Company, it will realize an average annual profit of RMB 91, 020, 000 after putting into place the newly added investment of 250 million RMB. That means an average annual returns rate of 13.83%, financial net present value of RMB254, 560,000, internal rate of return of 28.55%, break-even point at 73.84% and payback period of 4.11 years, which indicates that the Company has sound earning and anti-risk capacities and is quite worth of investment value.。
第2份:
医疗器械项目商业计划书
TABLE OF CONTENTS。
CHAPTER 1 PROJECT BACKGROUND 4。
CHAPTER 2 INTRODUCTION OF COMPANY AND ITS BUSINESS 5。
2.1 BRIEF INTRODUCTION OF THE COMPANY 5。
2.2 MANAGEMENT STRUCTURE 5。
2.3 KEY STAFF MANAGERS 6。
2.4 MAIN PRODUCTS 7。
2.5 SUCCESSFUL CLIENTS 7。
2.6 FINANCIAL CONDITIONS 9。
2.6.1 ASSETS AND DEBTS 9。
2.6.2 OUTSTANDING BUSINESS ACHIEVEMENTS 9。
2.7 KEY RESOURCES & ADVANTAGES 9。
2.8 DEVELOPING STRATEGY 10。
CHAPTER 3 MAIN PRODUCTS 11。
3.1 REGISTRATION CONSULTANT AND AGENT OF MEDICAL DEVICES FOR NATIVE AND FOREIGN CLIENTS 11。
3.2 CHINESE AGENTS OF ADVANCED MEDICAL DEVICES FROM FOREIGN COUNTRIES 11。
3.2.1 AGENT OF INSULIN NEEDLES 11。
3.2.2 NICC INFANT CATHETER AGENT 12。
3.2.3 OTHER PRODUCTS IN NEGOTIATION 13。
CHAPTER 4 ANALYSIS OF THE INDUSTRY AND MARKETING CONDITION 14。
4.1 MEDICAL DEVICE AND CATHETER INDUSTRY ANALYSIS 14。
4.1.1 SURVEY OF THE NATIONAL MEDICAL DEVICE IN TECHNOLOGY AND MARKET CONDITION 14。
4.1.2 SUMMARY OF THE INTERNATIONAL IMPLATABLE TPU CATHETER 15。
4.2 DOMESTIC MEDICAL DEVICES AND CATHETERS MARKET PRESENTATION 15。
4.2.1 DOMESTIC MEDICAL DEVICES MARKET 15。
4.2.2 PRESENTATION OF DOMESTIC MEDICAL CATHETER MARKET 16。
4.2.3THE TREND OF THE DOMESTIC MEDICAL DEVICE AND ONE-TIME-USE MEDICAL PRODUCTS DEVELOPMENT 16。
4.3 ANALYSIS OF MARKET CONDITION FOR OUR PRODUCTS 18。
4.3.1 DOMESTIC AND FOREIGN MEDICAL DEVICES REGISTRATION AGENT AND SERVICE FOR THE QUALITY SYSTEM CERTIFICATION 18。
4.3.2 MARKET ANALYSIS OF DOMESTIC INSULIN NEEDLE 18。
4.3.3 MARKET ANALYSIS OF THE NICC INFANT CATHETER 18。
4.3.4 ANAESTHESIA AND BREATH SYSTEM SUCTION CATHETER,RECOVER DEVICES OF BRAIN PARALYSIS 19。
4.4 SUMMARY OF MARKET ANALYSIS 19。
CHAPTER 5 COMPETITION STRATEGY AND MARKETING PLANNING OF RELEVANT PRODUCTS 20。
5.1 DOMESTIC AND FOREIGN REGISTRATION AGENT OF MEDICAL DEVICES AND THE QUALITY SYSTEM CERTIFICATION SERVICE 20。
5.1.1 STRATEGY CHOICE FOR THE PRODUCT 20。
5.1.2 MARKET PROMOTION PLANNING 20。
5.1.3 BUSINESS PLANNING 20。
5.2 INSULIN NEEDLES 21。
5.2.1 MARKET STRATEGY 21。
5.2.2 MARKET PLANNING 21。
5.3 NICC INFANT CATHETER PROJECT 21。
5.3.1 MARKET STRATEGY AND THE EXECUTING 21。
5.3.2 SALES PLANNING 21。
5.4 SALES PLANNING OF OTHER PRODUCTS 22。
CHAPTER 6 FINANCIAL ANALYSIS 23。
6.1 THE USING OF FINANCIAL FUND 23。
6.2 THE NEXT FIVE YEARS INCOME AND PROFIT ESTIMATE 23。
6.2.1 2005-2009 INCOME ESTIMATE 23。
6.2.2 2005-2009 PROFIT ESTIMATE 24。
6.3 FINANCIAL ANALYSIS ATTACHED CHART 24。
CHAPTER 7 FUNDING AND WITHDRAWING 25。
7.1 SELECTING THE FIXED RETURN FUNDING 25。
7.2 INVESTMENT WITHDRAWING PLAN 26。
CHAPTER 8 ANALYSIS OF RISK 27。
8.1 RISK ANALYSIS 27。
8.2 RISK CONTROL 27。
CHAPTER 9 SUMMARY 29。
百度在线翻译
So far we have received 10 from the IQC feedback abnormal wafers, has found that some NSOP standard, although most have been abandoned before the test, but there are 2 display has shipped. So I suggest the need to monitor with Jack to ensure that the product will not abnormal circulation to the next station to find a better solution to the front.。
谷歌的在线翻译
纳斯达克综合指数是反映纳斯达克证券市场行情变化的股票价美股三大指数遭重挫格平均指数,基本指数为100。纳斯达克的上市公司涵盖所有新技术行业,包括软件和计算机、电信、生物技术、零售和批发贸易等。主要由美国的数百家发展最快的先进技术、电信和生物公司组成,包括微软、英特尔、美国在线、雅虎这些家喻户晓的高科技公司,因而成为美国"新经济"的代名词。
纳斯达克综合指数是代表各工业门类的市场价值变化的晴雨表。因此,纳斯达克综合指数相比标准普尔500指数、道·琼斯工业指数(它仅包括30个著名大工商业公司,20家运输业公司和15家公用事业大公司)更具有综合性。纳斯达克综合指数包括5000多家公司,超过其他任何单一证券市场。因为它有如此广泛的基础,已成为最有影响力的证券市场指数之一。
1971年2月8日,股票交易发生了革命性的创新。那一天一个称之为纳斯达克(Nasdaq全美债券交易商自动报价)的系统为2,400只优质的场外交易(OTC)股票提供实时的买卖报价。在以前,这些不在主板上市的股票报价是由主要交易商和持有详细名单的经纪人公司提供的。纳斯达克链接着全国500多家造市商的终端,形成了计算机系统的中心。